Pack4EU

Projectduur
2023-2024
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Pack4EU’s core objective is to assess the current status of packaging, assembly, and test facilities in Europe. Additionally, it aims to analyse the evolving needs of the semiconductor industry regarding advanced packaging, assembly, and test developments. The focus includes mapping existing facilities, evaluating technological capabilities, and identifying areas for improvement. Ultimately, the project seeks to inform strategic decisions aligning with the semiconductor industry’s dynamic requirements.

Pack4EU’s objectives are:

1. The creation of the “Pan European network on advanced semiconductor packaging”.

2. Give guidance and deliver the awaited urgent results through policy recommendations, the “Advanced Semiconductor Packaging Master Plan for Europe”, addressing investments, pilot lines, competence centers and further coordination actions dedicated to semiconductor packaging and the EU green deal.

This will be worked on by a consortium gathering all the industry associations including the scientific ones supported by 40  partners all along the value chain. This group will first create a European definition of advanced semiconductor packaging illustrated by visuals and glossary.

For more information and news, visit the Pack4EU website: Pack4EU – Boost Semiconductor Packaging

 

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