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Chilas: a laser-focused role in the FLEXIT project

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The Chilas laser is one of the simplest hybrid photonic devices around, consisting of only two photonic integrated chips (PICs). Together, these offer unique characteristics: a wavelength agility with ultra-narrow linewidths of below 1 kHz, providing a very pure colour for a wide range of high-tech applications. Within the FLEXIT project, Chilas aims to adapt these two chips for compatibility with flip-chip assembly methods that rely on passive placing accuracies of ~1 µm for the scalable production of hybrid photonic devices.

On a technical level, Chilas develops and supplies high-end semiconductor external cavity tunable lasers with ultra-narrow ‎linewidths, which can be tuned over the C-band to cover a wavelength range larger than ‎‎100 nm ‎with a linewidth of less than 1 kHz, as well as high output power and ‎low noise. This laser is temperature-stabilised and comes in a 14-pin butterfly package. The external cavity laser (ECL) is constructed via hybrid integration of both an indium phosphide (InP) gain section and a silicon nitride (Si3N4) wavelength selective feedback PIC. The InP gain section provides the high-power output (>30 mW with 100 mW under development) over a wide wavelength range, whereas the Si3N4 PIC provides the low loss configurable feedback to the gain section.

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The FLEXIT project is funded by:

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