More about the Semicon 09 project:
In Semicon09, efforts are focused on developing manufacturing equipment for integrated photonics to enable the mass production of these components and devices. The project aims to standardise both front-end and back-end production processes for the fabrication of wafers with Photonic Integrated Circuits. The goal is to develop machines for various product families, using standard substrates such as SiN and InP. These advancements are crucial for the assembly of components, integrating various coupling methods like vertical and horizontal coupling. The project also aims to introduce new process developments in the front-end area for properties such as PZT and CVD.