Are you ready to dive into the cutting edge of advanced packaging and heterogeneous integration? Join us for a webinar on 11 November from 10:00 – 11:00 CEST that showcases the core technologies powering the APECS pilot line — your gateway to seamless process chains from design to packaging, including characterization, testing, and reliability.
In this follow-up session of the introduction webinar last September, you will discover how APECS supports next-generation applications in RF, optics, photonics, high-performance computing (HPC), and sensor systems. We’ll dive into the following technology work packages:
- Quasi-monolithic integration for chiplets with different functionalities for the highest integration and ultra low-power applications
- Chiplet integration platform for 2.5 and 3D systems including functional interposers, functional integration and advanced packaging and assembly
- CTR platform for the whole process chain
- STCO-design and simplifying the design of chiplet-based solutions
- Demonstrators for HPC, multi-material-sensors, photonics and RF chiplets
Whether you’re a semiconductor innovator, an R&D engineer, or a technology strategist, this webinar will give you a front-row seat to how the APECS pilot line accelerates innovation in heterogeneous integration.
Don’t miss your chance to get insights and connect with the APECS team of experts.
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APECS is the novel pan-European pilot line to establish a groundbreaking infrastructure for heterogeneous integration:
- By combining the know-how of various partners, APECS will offer services, capabilities and training for European companies and research organizations to integrate and package chiplets and further advanced electronic components into novel electronic systems
- By joining forces of Europes´ leading RTOs, the platform of capabilities to be developed will include novel characterization, quality assurance, testing & reliability methodologies and a System-Technology Co-Optimization (STCO) design framework to ensure quality, reliability, security, green manufacturing and fast production ramp-up in collaboration with manufacturing organizations
The APECS pilot line is coordinated by Fraunhofer and implemented by the Research Fab Microelectronics Germany (FMD). As a cooperation between the Fraunhofer Group for Microelectronics and the Leibniz Institutes FBH and IHP, the FMD is the central point of contact on all matters concerning applied research and development in the field of micro and nanoelectronics in Germany and Europe.
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What is APECS?
APECS (Advanced Packaging and Integration for Electronic Components and Systems) intends to establish itself as the pilot line that provides Europe with innovation capabilities in advanced packaging and heterogeneous integration of systems based on chiplets, QMI, RF, opto, sensor as well as passive components. The APECS pilot line will enable access to critical services, skills and training for European companies, especially SMEs, to integrate and package chiplets into novel electronic components and systems. Hence, it will open up a whole new landscape of new markets and opportunities for European business models. All developments will be carried out in accordance with the requirements of the European green deal. |