| On 23 September from 10:00 to 11:00 CEST, we invite you to a webinar that provides a comprehensive overview of the APECS pilot line, developed to drive innovation in advanced packaging and heterogeneous system integration across Europe.
It will introduce the consortium of partners involved in APECS, present the key enabling technologies and explain how European companies and RTOs can access the pilot line’s services and infrastructure.
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APECS is the novel pan-European pilot line to establish a groundbreaking infrastructure for heterogeneous integration:
- By combining the know-how of various partners, APECS will offer services, capabilities and training for European companies and research organizations to integrate and package chiplets and further advanced electronic components into novel electronic systems.
- By joining forces of Europes´ leading RTOs, the platform of capabilities to be developed will include novel characterization, quality assurance, testing & reliability methodologies and a System-Technology Co-Optimization (STCO) design framework to ensure quality, reliability, security, green manufacturing and fast production ramp-up in collaboration with manufacturing organizations.
The APECS pilot line is coordinated by Fraunhofer and implemented by the Research Fab Microelectronics Germany (FMD). As a cooperation between the Fraunhofer Group for Microelectronics and the Leibniz Institutes FBH and IHP, the FMD is the central point of contact on all matters concerning applied research and development in the field of micro and nanoelectronics in Germany and Europe.
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What is APECS?
APECS (Advanced Packaging and Integration for Electronic Components and Systems) intends to establish itself as the pilot line that provides Europe with innovation capabilities in advanced packaging and heterogeneous integration of systems based on chiplets, QMI, RF, opto, sensor as well as passive components. The APECS pilot line will enable access to critical services, skills and training for European companies, especially SMEs, to integrate and package chiplets into novel electronic components and systems. Hence, it will open up a whole new landscape of new markets and opportunities for European business models. All developments will be carried out in accordance with the requirements of the European green deal. |