Connecting the PIC Industry

The 11th PIC International builds on the strengths of the event’s previous editions, with around 40 leaders from industry and academia delivering presentations falling within four key themes:

• Foundations of PIC design: materials, devices and processes
• Connectivity and scalability for secure, high-speed data networks
• Emerging applications: photonics for sensing, imaging and beyond
• Future computing: PICs for photonic processing, quantum computers, and neural networks

Conference attendees will gain greater insights into device technologies while learning of the latest opportunities and trends within the PIC industry. Delegates will also discover significant advances in tools and processes that deliver enhanced performance and higher yields.

As the longest running PIC dedicated event, PIC international hosts the key decision makers from the whole of the PIC supply chain, from materials and equipment suppliers, foundries and advanced packaging houses, module and subsystem supplies, all the way to OEM and equipment makers.

PIC International is part of AngelTech, bringing together an Innovation Summit, four co-located conferences and an exhibition with more than 120 presentations, more than 700 delegates and over 80 exhibitors. AngelTech is the only global event covering Compound Semiconductor, PICs, Power Electronics and Advanced Packaging technologies, bringing the key executives all together under one roof for three days of networking and insight.